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US 10,896,862 B2Granted
Thermal interface material on package
AssigneeInternational Business Machines Corporation
InventorsIsabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Abstract
A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.
Claims19
A method, comprising:
- dispensing a thermal interface material (TIM) on an electronic assembly;
- pressing a lid onto the electronic assembly to perform a packaged assembly;
- performing a sonoscan of the packaged assembly for determining a presence of voiding in the TIM.
A method, comprising:
- dispensing a thermal interface material (TIM) on a chip disposed on a laminate;
- applying an adhesive around a periphery of the laminate;
- pressing the lid onto the adhesive and the TIM to form a packaged assembly;
- and
- performing a sonoscan of the packaged assembly to determine a presence of voiding in the TIM.
2 more elements
Dependencies are inferred from the claim text.