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US 10,896,861 B2Granted
Heterogeneous multi-layer MMIC assembly
AssigneeRaytheon Company
InventorsDavid D. Heston, John G. Heston, Claire E. Mooney, Mikel J. White, Jon Mooney, Tiffany Cassidy
Life of this patent
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Abstract
An HPA MMIC assembly includes a MMIC device coupled to a thermal spreader. A ground plane is provided on the thermal spreader and coupled to FETs in the MMIC device. The multiple levels of metal separated by multiple dielectric layers provide low-loss broad-band microstrip circuits. The thermal spreader may include diamond, an air/wire-edm spreader or a multi-layer board (MLB) with heat sink vias and ground vias.
Claims9
A monolithic microwave integrated circuit (MMIC) assembly, comprising:
- a MMIC device, having a device patterned ground plane layer, the MMIC device generating a heat profile across the device patterned ground plane layer during operation;
- a device patterned circuit layer disposed on a first surface of the MMIC device;
- a thermal spreader coupled to the MMIC device;
- and
- a spreader ground plane disposed on the thermal spreader, the spreader ground plane having a shape corresponding to the heat profile of the MMIC device and which comprises a plurality of surface areas corresponding to heat producing components of the MMIC device,
- wherein the device patterned ground plane layer and the spreader ground plane are coupled to one another,
- wherein the thermal spreader comprises a dielectric material disposed therein, and
- wherein a portion of the device patterned circuit layer is adjacent a surface of the thermal spreader not covered by the spreader ground plane,
- whereby a low ground inductance is provided to the MMIC device.
6 more elements
Dependencies are inferred from the claim text.