Method and curable compound for casting electronic components or component groups
AssigneeRobert Bosch GmbH
InventorsArno Reil, Juergen Wieser, Jan Spengler, Roland Klein, Alexandra Kreickenbaum
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AssigneeRobert Bosch GmbH
InventorsArno Reil, Juergen Wieser, Jan Spengler, Roland Klein, Alexandra Kreickenbaum
Estimating the term…
The present invention relates to a method for casting electronic components. The invention also relates to a curable compound that can be used as casting compound in the method. The casting compound contains at least one cross-linking component which is homogeneously distributed in the casting compound and can cross-link to at least two different cross-linked systems. A first of these networks has a higher cross-link density than a second cross-linked system, wherein the cross-linking to the first cross-linked system is triggered via an event other than the cross-linking to the second cross-linked system. During casting, the at least one cross-linking component of the casting compound is cured at least in part to the first cross-linked system in at least one first region spaced from the components and at least to the second cross-linked system in a second region enclosing and immediately surrounding the components.
A method for casting electronic components or component groups, in which the component or the component group is embedded in a casting compound which is cured via at least one cross-linking process, wherein:
Dependencies are inferred from the claim text.