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US 10,896,846 B2Granted
Controlling performance and reliability of conductive regions in a metallization network
AssigneeInternational Business Machines Corporation
InventorsRaghuveer Patlolla, Cornelius Brown Peethala, Chih-Chao Yang
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Abstract
Methods for forming conductive regions of a metallization network with reduced leakage current and capacitance are described. Aspects of the invention include forming a trench in a dielectric material on the substrate, forming a first liner layer in a first portion of the trench, forming a second liner layer in a second portion of the trench, and forming a conductive material over the second liner layer in the trench.
Claims20
A semiconductor structure comprising:
- a first liner layer formed in a first portion of a first trench and a second portion of a second trench, each the first trench and second trench are formed in a dielectric material on a substrate;
- a second liner layer formed over a third portion of the first trench and a fourth portion of the second trench;
- a first conductive material formed over the second liner layer in the first trench;
- a second conductive material formed over the second liner layer in the second trench;
- wherein the first liner layer is not present over a first bottom surface of the first trench and is not present over a second bottom surface of the second trench;
- wherein a portion of the second liner is over the first bottom surface of the first trench and the second bottom surface of the second trench are defined by a portion of the dielectric material;
- and
- a copper barrier formed at the first bottom surface of the first trench and the second bottom surface of the second trench, wherein the copper barrier comprises an alloy material in the second liner layer, oxygen, and silicon in the dielectric material on the substrate.
5 more elements
A semiconductor structure comprising:
- a first liner layer formed in a first portion of a trench formed in a dielectric material on a substrate, wherein the dielectric material on the substrate comprises a carbon depleted region;
- a second liner layer formed over a second portion of the trench;
- and
- a conductive material formed over the second liner layer in the trench;
- wherein the first liner layer is not present over a bottom surface of the trench;
- wherein at least a portion of the second liner layer is over the bottom surface of the trench;
- wherein the bottom surface of the trench is defined by a portion of the dielectric material;
- and
- a copper barrier formed at the bottom surface of the trench, wherein the copper barrier comprises an alloy material in the second liner layer, oxygen, and silicon in the dielectric material on the substrate.
6 more elements
Dependencies are inferred from the claim text.