Back to results
US 10,896,840 B2Granted
Tape heating methods
AssigneeSemiconductor Components Industries, LLC
InventorMichael J. Seddon
Life of this patent
Estimating the term…
Abstract
Implementations of a method of increasing the adhesion of a tape. Implementations may include: mounting a tape to a frame, mounting a substrate to the tape, heating the tape after mounting the substrate at one or more temperatures for a predetermined period of time, and increasing an adhesion of the tape to the substrate through heating the tape.
Claims19
A method of increasing an adhesion of a dicing tape, the method comprising:
- mounting the dicing tape to a frame;
- adhering a substrate directly to the dicing tape through mounting the substrate to the dicing tape after the dicing tape is mounted to the frame;
- heating the dicing tape after mounting the substrate at one or more temperatures for a predetermined period of time to increase an adhesion of the dicing tape to the substrate through the heating of the dicing tape;
- and
- removing one or more portions of the substrate through releasing the dicing tape from the one or more portions;
- wherein the one or more temperatures is one of a temperature ramp up, a temperature ramp down, or any combination thereof during the predetermined period of time.
3 more elements
A method of increasing an adhesion of a dicing tape, the method comprising:
- adhering a semiconductor substrate directly to dicing tape through mounting the semiconductor substrate to the dicing tape after mounting the dicing tape to a frame;
- heating the dicing tape after mounting the semiconductor substrate at one or more temperatures less than 100 C for a predetermined period of time to increase an adhesion of the dicing tape to the semiconductor substrate through the heating of the dicing tape;
- and
- removing one or more portions of the substrate through releasing the dicing tape from the one or more portions.
1 more element
A method of preventing die loss from a dicing tape, the method comprising:
- adhering a semiconductor substrate directly to a dicing tape through mounting the semiconductor substrate to the dicing tape;
- heating the dicing tape after mounting the semiconductor substrate at one or more temperatures for a predetermined period of time to increase an adhesion of the plurality of die to the dicing tape through the heating of the dicing tape;
- at least partially singulating a plurality of die from the semiconductor substrate before heating the dicing tape;
- preventing die from prematurely decoupling from the dicing tape during subsequent processing operations through the increasing adhesion of the plurality of die to the dicing tape;
- and
- removing one or more portions of the substrate through releasing the dicing tape from the one or more portions.
3 more elements
Dependencies are inferred from the claim text.