Electrostatic chucks and substrate processing apparatus including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsMinsung Kim, Myoung Soo Park, Dougyong Sung, Yun-Kwang Jeon
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Abstract
An electrostatic chuck includes a base, a dielectric plate on the base, a chuck electrode in the dielectric plate, and a lower heater section including lower heaters in the dielectric plate between the chuck electrode and the base, and a lower ground electrode between the lower heaters and the base. The chuck further includes an upper heater section including upper heaters between the lower heaters and the chuck electrode, and a upper ground electrode between the upper heaters and the lower heaters, and a plurality of via contact electrodes connecting the upper ground electrode into the lower ground electrode.
Claims19
An electrostatic chuck comprising:
- a base;
- a dielectric plate on the base;
- a chuck electrode in the dielectric plate;
- and
- a lower heater section including lower heaters in the dielectric plate between the chuck electrode and the base, and a lower ground electrode between the lower heaters and the base;
- an upper heater section including upper heaters between the lower heaters and the chuck electrode, and an upper ground electrode between the upper heaters and the lower heaters;
- and
- a plurality of via contact electrodes connecting the upper ground electrode to the lower ground electrode,
- wherein the lower heater section further comprises lower plate electrodes between the lower heaters and the lower ground electrode, and
- wherein the upper heater section further comprises upper plate electrodes between the upper ground electrode and the lower heaters.
An electrostatic chuck comprising:
- a base having an edge region and a center region inside the edge region;
- a plurality of connectors in the center region;
- a dielectric plate on the base and the plurality of connectors;
- a chuck electrode disposed in the dielectric plate and connected to the plurality of connectors;
- a lower heater section including a lower heater between the chuck electrode and the plurality of connectors, a lower ground electrode between the lower heater and the plurality of connectors, and a lower plate electrode between the lower ground electrode and the lower heater;
- and
- an upper heater section including an upper heater between the lower heater and the chuck electrode, an upper plate electrode between the upper heater and the lower heater, and an upper ground electrode between the upper plate electrode and the upper heater,
- wherein the lower ground electrode is connected to the upper ground electrode.
A substrate processing apparatus, comprising:
- a chamber;
- and
- an electrostatic chuck configured to hold a substrate in the chamber,
- wherein the electrostatic chuck comprises:
- a base;
- a dielectric plate on the base;
- a chuck electrode in the dielectric plate;
- and
- a lower heater section including lower heaters in the dielectric plate between the chuck electrode and the base, and a lower ground electrode between the lower heaters and the base;
- an upper heater section including upper heaters between the lower heaters and the chuck electrode, and an upper ground electrode between the upper heaters and the lower heaters;
- and
- a via contact electrode connecting the upper ground electrode to the lower ground electrode,
- wherein the lower heater section further comprises lower plate electrodes between the lower heaters and the lower ground electrode, and
- wherein the upper heater section further comprises upper plate electrodes between the upper ground electrode and the lower heaters.
Dependencies are inferred from the claim text.