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US 10,896,827 B2Granted
Support for manufacturing semiconductor packages, use of support for manufacturing semiconductor packages, and method for manufacturing semiconductor packages
AssigneeZeon Corporation
InventorIchiro Hazeyama
Life of this patent
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Abstract
To provide a support for manufacturing semiconductor packages which has excellent durability in treatments such as polishing, heating, exposing/developing, plating, and vacuuming; a use of the support for manufacturing semiconductor packages; and a method of manufacturing semiconductor packages. The support includes a substrate layer and an adhesive layer adjacent to the substrate layer, wherein the substrate layer is formed of an alicyclic structure-containing resin film.
Claims6
A support for manufacturing semiconductor packages, comprising:
- a substrate layer;
- and
- an adhesive layer adjacent to the substrate layer,
- wherein the substrate layer is formed of an alicyclic structure-containing resin film,
- wherein the alicyclic structure-containing resin film comprises an alicyclic structure-containing polymer as a resin component,
- wherein the alicyclic structure-containing polymer is one having crystallinity,
- wherein the amount of the alicyclic structure-containing polymer in the alicyclic structure-containing resin film is 50% by mass or more,
- wherein the alicyclic structure-containing polymer is a polymer of dicyclopentadiene, and
- wherein the dicyclopentadiene has exo isomer and a proportion of the exo isomer is 80% or more.
6 more elements
Dependencies are inferred from the claim text.