Mold

A mold comprising:

• a first surface to be in contact with a surface of a substrate to be processed;
• a cavity portion that recedes in a first direction in which the cavity portion is away from the first surface, a resin material being introduced into the cavity portion;
• a vent portion that recedes in the first direction and that is closer to the first surface than the cavity portion, the vent portion that communicates with the cavity portion and that serves as a plurality of discharge path for gas inside the cavity portion;
• a suction portion that recedes in the first direction and that is farther from the first surface than the vent portion, the suction portion communicating with the vent portion;
• a first shut-off pin provided between the vent portion and the suction portion to open and partially close the discharge path so as to suppress the resin material, but not to completely close the discharge path of the resin material;
• a second shut-off pin provided between the first shut-off pin and the suction portion to open and close the discharge path so as not to pass the resin material through the discharge path;
• and
• a first sensor to detect at least one of first parameters including a temperature of the mold, a pressure of the resin material, intensity of reflected light or intensity of transmitted light of the discharge path, and a time after the first shut-off pin is brought into a partially closed state;
• and
• a second sensor to detect at least one of second parameters including a temperature of the mold, a pressure of the resin material, intensity of reflected light or intensity of transmitted light of the discharge path and a time after the first shut-off pin is brought into a partially closed state, wherein
• the first shut-off pin brings the discharge path into a partially closed state based on at least one of the first parameters, and
• the second shut-off pin brings the discharge path into a closed state based on at least one of the second parameters.