Main board and computer apparatus with connectors of both dual in-line package and surface mount technology
AssigneeWistron Corporation
InventorsYao-Chung Chang, Wen-Jui Hsu
Life of this patent
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Abstract
A main board and a computer apparatus having the main board are provided. The main board includes a printed circuit board (PCB), a first connector, and a second connector. The PCB is configured for being electrically connected to a processor. The first connector is electrically connected to the PCB in a dual in-line package (DIP) manner, and is configured for a memory to be mounted to the first connector. The second connector is electrically connected to the PCB in a surface mount technology (SMT) manner, and is configured for the memory to be mounted to the second connector. Accordingly, transmission performance of memory signals may be improved.
Claims20
A main board, comprising:
- a printed circuit board, electrically connected to a processor;
- a first vertical interconnect access (via), electrically connected to the processor;
- a first connector, electrically connected to the printed circuit board in a dual in-line (DIP) package manner, wherein the first connector is disposed on the first via and a first memory is mountable to the first connector using a matching DIP connector;
- and
- a second connector, distinct from the first connector and disposed adjacent to the first connector at a finite distance and electrically connected to the printed circuit board in a surface mount technology (SMT) manner, wherein a second memory is mountable to the second connector using a matching SMT connector,
- wherein the first connector, the second connector, the first memory, the second memory and the processor are mounted on a top planar surface of the printed circuit board.
A computer apparatus, comprising:
- a first memory;
- a second memory;
- a processor;
- a main board, comprising:
- a printed circuit board;
- a first vertical interconnect access (via), electrically connected to the processor;
- a first connector, electrically connected to the printed circuit board in a dual in-line package (DIP) manner, wherein the first connector is disposed on the first via and the first memory is mountable to the first connector using a matching DIP connector;
- and
- a second connector, distinct from the first connector and disposed adjacent to the first connector at a finite distance electrically connected to the printed circuit board in a surface mount technology (SMT) manner, wherein the second memory is mountable to the second connector using a matching SMT connector;
- and
- a processor, electrically connected to the printed circuit board,
- wherein the first connector, the second connector, the first memory, the second memory and the processor are mounted on a top planar surface of the printed circuit board.
Dependencies are inferred from the claim text.