Circuit protection device with PTC element and secondary fuse
AssigneeLittelfuse, Inc.
InventorsYuriy Borisovich Matus, Martin Pineda, Kedar V. Bhatawadekar
Life of this patent
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Abstract
A circuit protection device including a primary fuse, and a positive temperature coefficient (PTC) device and a secondary fuse electrically connected in series with one another and in parallel with the primary fuse, the secondary fuse formed of a quantity of solder disposed on a dielectric surface, wherein the dielectric surface exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric surface to create a galvanic opening.
Claims18
A circuit protection device comprising:
- a primary fuse;
- and
- a positive temperature coefficient (PTC) device and a secondary fuse electrically connected in series with one another and in parallel with the primary fuse, the secondary fuse comprising a quantity of solder disposed on a dielectric surface, wherein the dielectric surface exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric surface to create a galvanic opening;
- wherein the primary fuse is disposed on a first side of a dielectric substrate and the PTC device is connected to a second side of the dielectric substrate opposite the first side by a dielectric cap that defines the dielectric surface.
A circuit protection device comprising:
- a dielectric substrate;
- a primary fuse disposed on a first side of the dielectric substrate and having first and second terminals electrically connected to respective first and second conductive traces on the dielectric substrate;
- a positive temperature coefficient (PTC) device and a secondary fuse electrically connected in series with the with one another and in parallel with the primary fuse, the PTC device attached to a second side of the dielectric substrate by a dielectric cap covering an end of the PTC device, the secondary fuse comprising a quantity of solder extending from a first electrode of the PTC device onto the dielectric cap, wherein the dielectric cap exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric cap to create a galvanic opening;
- and
- a first lead wire and a second lead wire for electrically connecting the circuit protection device within a circuit, wherein the first lead wire is electrically connected to the first terminal of the primary fuse and to the secondary fuse, and wherein the second lead wire is electrically connected to the second terminal of the primary fuse and to a second electrode of the PTC device;
- wherein the first and second lead wires are connected to the first and second terminals of the primary fuse, respectively, by first and second electrically conductive vias formed in the dielectric substrate.
Dependencies are inferred from the claim text.