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US 10,895,512 B2Granted
Pressure measuring arrangement including two pressure measurement sensors on a carrier
AssigneeInfineon Technologies AG
InventorDirk Hammerschmidt
Life of this patent
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Abstract
A pressure measuring arrangement is proposed. The pressure measuring arrangement includes a first MEMS pressure sensor arranged on a carrier, and also a second MEMS pressure sensor arranged on the carrier. Furthermore, the pressure measuring arrangement includes an integrated circuit arranged on the carrier, the integrated circuit being coupled to the first MEMS pressure sensor and the second MEMS pressure sensor.
Claims21
A pressure measuring arrangement, comprising:
- a first MEMS pressure sensor arranged on a carrier;
- a second MEMS pressure sensor arranged on the carrier;
- and
- an integrated circuit arranged on the carrier, the integrated circuit being coupled to the first MEMS pressure sensor and the second MEMS pressure sensor,
- wherein the first MEMS pressure sensor is arranged on a first surface of the carrier, and wherein the second MEMS pressure sensor is arranged on a second surface of the carrier, the second surface being opposite to the first surface such that the carrier is arranged between the first MEMS pressure sensor and the second MEMS pressure sensor, wherein the first surface and the second surface define a thickness of the carrier.
2 more elements
A pressure measuring arrangement, comprising:
- a first MEMS pressure sensor arranged on a carrier;
- a second MEMS pressure sensor arranged on the carrier;
- and
- an integrated circuit arranged on the carrier, the integrated circuit being coupled to the first MEMS pressure sensor and the second MEMS pressure sensor,
- wherein the first MEMS pressure sensor and the second MEMS pressure sensor are arranged on a main surface of the carrier,
- wherein the integrated circuit is arranged on the main surface of the carrier, and
- wherein the integrated circuit extends along the main surface of the carrier such that a first part of the integrated circuit is interposed between the main surface of the carrier and the first MEMS pressure sensor and a second part of the integrated circuit is interposed between the main surface of the carrier and the second MEMS pressure sensor.
4 more elements
A pressure measuring arrangement, comprising:
- a carrier;
- a common die arranged on the carrier;
- a first MEMS pressure sensor integrated within the common die;
- a second MEMS pressure sensor arranged on a surface of the common die such that the common die is interposed between the second MEMS pressure sensor and the carrier;
- and
- an integrated circuit that is integrated within the common die, the integrated circuit being coupled to the first MEMS pressure sensor and to the second MEMS pressure sensor,
- wherein the common die and the second MEMS pressure sensor are arranged on a main surface of the carrier, and
- the second MEMS pressure sensor is adhesively bonded onto the integrated circuit.
5 more elements
A pressure measuring arrangement, comprising:
- a first MEMS pressure sensor arranged on a carrier;
- a second MEMS pressure sensor arranged on the carrier;
- and
- an integrated circuit arranged on the carrier, the integrated circuit being coupled to the first MEMS pressure sensor and the second MEMS pressure sensor,
- wherein the integrated circuit is configured to determine whether a measurement value of the first MEMS pressure sensor corresponds to a measurement value of the second MEMS pressure sensor in accordance with a predefined criterion.
2 more elements
Dependencies are inferred from the claim text.