Gold nanostructures and processes for their preparation
AssigneeBen-Gurion University of the Negev Research and Development Authority
InventorsRaz Jelinek, Ahiud Morag
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Abstract
An electroless process for depositing gold (Au0) from a solution, comprising allowing gold (Au0) place from a solution of gold thiocyanate complex dissolved in a mixture of water-miscible organic solvent and water, or the deposition of gold (Au0) takes place on a deposition-directing layer comprising positively charged organic groups, said layer being provided on at least a portion of a surface of a substrate sought to be gold-coated.
Claims16
An electroless process for depositing gold from a solution, comprising providing a solution of a source of of gold thiocyanate complex comprising M+[Au(SCN)4]1−, or M+[Au(SCN)2]1−, wherein M is a metal, and combinations thereof, and subjecting a substrate sought to be gold-plated to said solution to deposit Au0 from said solution, wherein said deposition is a spontaneous reduction of gold of said complex by thiocyanate carried out in the absence of an auxiliary reducing agent, further wherein
- 1) said solution is said gold thiocyanate complex dissolved in a mixture of water-miscible organic solvent and water, and said spontaneous reduction occurring upon evaporation of said solution, or
- 2) at least a portion of said surface comprises a deposition-directing layer comprising positively charged non-metallic groups.
An electroless process for depositing gold from a solution comprising providing a solution of a source of gold thiocyanate complex selected from the group consisting of M+[Au(SCN)4]1−, M+[Au(SCN)2]1−, wherein M is a metal, and combinations thereof, and and subjecting a substrate sought to be gold-plated to said solution to deposit Au from said solution, wherein said deposition is a spontaneous reduction of gold of said complex by thiocyanate carried out in the absence of an auxiliary reducing agent, and further wherein said solution is said gold thiocyanate complex dissolved in a mixture of water-miscible organic solvent and water, and said spontaneous reduction occurring upon evaporation of said solution.
An electroless process for depositing gold from a solution onto a substrate, comprising providing a solution of of a source of gold thiocyanate complex selected from the group consisting of M+[Au(SCN)4]1−, M+[Au(SCN)2]1−, wherein M is a metal, and combinations thereof, and subjecting a substrate sought to be gold-plated to said solution to deposit Au0 from said solution, wherein said deposition is a spontaneous reduction of gold of said complex by thiocyanate carried out in the absence of an auxiliary reducing agent upon evaporation of said solution, and further wherein at least a portion of said surface comprises a deposition-directing layer comprising positively charged non-metallic groups upon evaporation of said solution.
Dependencies are inferred from the claim text.