Composition for removing silicone resins and method of thinning substrate by using the same

A composition for removing silicone resins, the composition comprising:

• a heterocyclic solvent;
• and
• an alkyl ammonium fluoride salt represented by Formula (1):
• (R)4N+F− Formula (1)
• wherein R is a C3 or C4 linear alkyl group;
• wherein the alkyl ammonium fluoride salt is present in an amount of about 0.1 wt % to about 10 wt % based on a total weight of the composition,
• wherein the heterocyclic solvent has a 4- to 8-membered ring;
• wherein the heterocyclic solvent is at least one selected from the group consisting of a nitrogen-containing and oxygen-containing heterocyclic solvent;
• and
• wherein the heterocyclic solvent is present in an amount of about 70 wt % to about 99.9 wt % based on a total weight of the composition.

A system for temporarily bonding a target substrate to a carrier substrate to facilitate processing of the target substrate, the system comprising:

• a carrier substrate;
• a silicone binder configured to bond the carrier substrate to the target substrate;
• a separation apparatus configured to separate the carrier substrate and the target substrate from one another such that a residue of the silicone binder remains on the target substrate;
• and
• a composition configured to remove the residue, wherein the composition comprises a heterocyclic solvent and an alkyl ammonium fluoride salt represented by Formula (1):
• (R)4N+F− Formula (1)
• wherein R is a C3 or C4 linear alkyl group,
• wherein the heterocyclic solvent comprises at least one selected from the group consisting of a pyridine solvent, a morpholine solvent, a piperazine solvent, a urea solvent, and an oxazolidinone solvent, and
• wherein the composition comprises a protic solvent in an amount of 3 wt % of less based on a total weight of the composition, wherein the heterocyclic solvent is present in an amount of about 90 wt % to about 99 wt % based on a total weight of the composition, and wherein the alkyl ammonium fluoride salt represented by Formula (1) is present in an amount of about 0.1 wt % to about 10 wt % based on a total weight of the composition.