Composite particles, method of refining and use thereof

A chemical mechanical planarization (CMP) polishing composition, comprising

• 0.01 wt.% to 20 wt.% of composite particles refined from a refining process comprising at least one step selected from the group consisting of (1) filtration;
• (2) bowl centrifuge;
• (3) fixed angle rotational centrifuge;
• (4) gravitational settling;
• (5) optimization of calcination and milling processes;
• and combinations thereof;
• wherein
• the refined composite particles comprise single particles and aggregated particles;
• the single particle comprises a core particle with surfaces covered by nanoparticles;
• the core particle is selected from the group consisting of silica, alumina, titania, zirconia, polymer particle, and combinations thereof;
• and the nanoparticle is selected from the compounds of a group consisting of zirconium, titanium, iron, manganese, zinc, cerium, yttrium, calcium, magnesium, fluorine, lanthanum, strontium nanoparticle, and combinations thereof;
• >0 and ≤7 wt.% of the refined composite particles are the aggregated particles comprising at least 3 single particles;
• and
• change of size distribution of refined composite particles under a disintegrative force is less than 10%;
• water;
• pH of the CMP composition ranges from about 2 to about 12;
• and
• optionally
• 0.0001 wt.% to about 5 wt.% of a pH adjusting agent selected from the group consisting of sodium hydroxide, cesium hydroxide, potassium hydroxide, cesium hydroxide, ammonium hydroxide, quaternary organic ammonium hydroxide, and combinations thereof;
• 0.000001 wt.% to 0.5 wt.% of a chemical additive elected from the group consisting of a compound having a functional group selected from the group consisting of organic carboxylic acids, amino acids, amidocarboxylic acids, N-acylamino acids, and their salts thereof;
• organic sulfonic acids and salts thereof;
• organic phosphonic acids and salts thereof;
• polymeric carboxylic acids and salts thereof;
• polymeric sulfonic acids and salts thereof;
• polymeric phosphonic acids and salts thereof;
• arylamines, aminoalcohols, aliphatic amines, heterocyclic amines, hydroxamic acids, substituted phenols, sulfonamides, thiols, polyols having hydroxyl groups, and combinations thereof;
• 0.0001 wt.% to about 10 wt.% of a surfactant selected from the group consisting of a). Non-ionic surface wetting agents;
• b). Anionic surface wetting agents;
• c). Cationic surface wetting agents;
• d). ampholytic surface wetting agents;
• and combinations thereof;
• 0.001 wt.% to 5 wt.% of water soluble polymer selected from the group consisting of anionic polymer, cationic polymer, non-ionic polymer, and combinations thereof;
• 0.01 wt.% to 3.0 wt.% of chelators;
• corrosion inhibitor;
• oxidizer;
• and
• biological growth inhibitor.