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US 10,894,900 B2Granted
Polyamide compositions for sealants and high solids paints
AssigneeElementis Specialties, Inc.
InventorsWouter Ijdo, Yanhui Chen, James Heck, Carlos Feito, Elke Piron
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Abstract
A polyamide composition for use in sealants, adhesives and high solids coatings.
Claims9
A high solids coating composition comprising a first pack and a second pack;
- wherein the first pack comprises:
- (a) a resin;
- (b) a polyamide composition consisting essentially of a polyamide, having groups derived from:
- a diamine selected from the group consisting of ethylene diamine and hexamethylene diamine;
- a straight chain monocarboxylic acid having 1 to 5 carbon atoms;
- wherein the straight chain monocarboxylic acid is independently selected from the group consisting of:
- acetic acid, propionic acid, and combinations thereof;
- and
- a fatty acid independently selected from the group consisting of:
- 12-hydroxystearic acid, lesquerolic acid and combinations thereof;
- wherein the diamine, the straight chain monocarboxylic acid and fatty acid have a molar ratio range selected from the group consisting of:
- ranging from 1:1.75:0.25 to 1:0.75:1.25;
- or ranging from 1:1.5:0.5 to 1:1:1;
- and said polyamide composition having a median particle size ranging from 1 μm to 10 μm;
- (c) a diluent;
- and the second pack comprises:
- at least one cross linking agent or a hardening agent;
- wherein the high solids composition has a solids content of at least 70 wt. %, and wherein the polyamide is activated upon mixing the ingredients of pack one between 25° C. and 50° C.
15 more elements
Dependencies are inferred from the claim text.