Low dielectric resin composition, film and circuit board using the same
AssigneeZhen Ding Technology Co., Ltd.
InventorsSzu-Hsiang Su, Shou-Jui Hsiang, Mao-Feng Hsu, Ming-Jaan Ho
Life of this patent
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Abstract
A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.
Claims12
A low dielectric polyimide composition comprising:
- a low dielectric resin containing acid anhydride;
- an epoxy resin;
- polyphenylene ether resin with vinyl and active esters;
- maleic acid liquid polybutadiene;
- and
- an accelerator;
- wherein the low dielectric resin containing acid anhydride is selected from the group consisting of maleic anhydride graft modified resin, polyimide resin containing anhydride, and combination thereof;
- wherein the dielectric constant of the low dielectric resin containing acid anhydride is less than 3 at a frequency of 10 GHz.
A film comprising:
- at least one release film;
- and
- a resin layer, at least one surface of the resin layer is attached to one surface of the at least one release film, the resin layer is made by low dielectric resin composition, the low dielectric resin composition comprising:
- a low dielectric resin containing acid anhydride;
- an epoxy resin;
- polyphenylene ether resin with vinyl and active esters;
- maleic acid liquid polybutadiene;
- and
- an accelerator;
- wherein the low dielectric resin containing acid anhydride is selected from the group consisting of maleic anhydride graft modified resin, polyimide resin containing anhydride, and combination thereof;
- wherein the dielectric constant of the low dielectric resin containing acid anhydride is less than 3 at a frequency of 10 GHz.
Dependencies are inferred from the claim text.