Removal of inorganic coatings from glass substrates
AssigneeCorning Incorporated
InventorsYuhui Jin, Aize Li
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Abstract
Methods of etching an inorganic layer on a glass substrate are described, the methods comprising contacting the glass substrate including an inorganic layer with an etching solution comprising a polar organic solvent and an etchant, wherein the inorganic layer is removed at an inorganic layer etching rate and the glass substrate is etched as a glass etching rate.
Claims29
A method of controlling the etch rate of a glass substrate including an inorganic layer, the method comprising contacting the glass substrate including the inorganic layer with an etching solution comprising a polar organic solvent and an etchant selected from HCl, NH4HF2, HF, NaOH, KOH, tetramethyl ammonium hydroxide, and combinations thereof, wherein the inorganic layer includes titanium and the inorganic layer is removed at an inorganic layer etching rate and the glass substrate is etched as a glass etching rate and the glass substrate comprises an ion exchanged glass composition with a compressive stress layer having a compressive depth of layer of at least 10 μm and extending from a surface of the glass to the depth of layer, and wherein the compressive layer is under a compressive stress of at least about 300 MPa.
Dependencies are inferred from the claim text.