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US 10,894,335 B2Granted
Cutting apparatus
AssigneesHyundai Motor Company, Kia Motors Corporation
InventorHee Sang Park
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a cutting apparatus including a jig having a seating jig on which a machining target is seated and a fixing jig matched with the seating jig to fix the machining target, a cutter configured to cut the machining target along reference scheduled cutting lines, a first carrier reciprocating to allow the fixing jig to match with the seating jig or to be spaced apart from the seating jig, and a cooler configured to cool the machining target down to a reference temperature.
Claims12
A cutting apparatus comprising:
- a jig unit having a seating jig on which a machining target is seated and a fixing jig matched with the seating jig to fix the machining target;
- a first cutter configured to cut the machining target along first scheduled cutting lines of the machining target;
- a first carrier configured to reciprocate to allow the fixing jig to match with the seating jig;
- and
- a cooler configured to cool the machining target down to a reference temperature,
- wherein the first carrier includes:
- a mounting plate on which the fixing jig and the first cutter are mounted;
- and
- a transfer cylinder configured to reciprocate to allow the mounting plate to approach the machining target or to be spaced apart from the machining target, and
- wherein the transfer cylinder is configured to position the mounting plate in a fixing position where the fixing jig is in contact with the machining target while the first cutter is spaced apart from and thus is not in contact with the machining target in order to fix the machining target during cooling of the cooler without cutting the machining target.
7 more elements
Dependencies are inferred from the claim text.