Ozone abatement method for semiconductor manufacturing system
AssigneeInternational Business Machines Corporation
InventorEdward L. Pepe
Life of this patent
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Abstract
An apparatus and method for abating ozone and reducing sulfuric acid from an exhaust stream. In a semiconductor manufacturing plant the processing of wafers involves the cleaning and etching of wafers, the resultant processing may produce gasses which must be abated. The apparatus and method utilizes UV light in high doses to convert ozone (O3) to oxygen (O2). By ensuring laminar flow through the UV light chambers, the efficiency of the system is sufficient to allow for the remaining impurities in the exhaust air to be removed through the use of an RTO.
Claims20
A method comprising:
- causing exhaust air from an exhaust duct to enter an ozone abatement chamber comprising a central chamber and one or more UV lamps, the central chamber comprising a first series of laminar flow plates to ensure laminar flow through the central chamber;
- reducing a volume of sulfuric acid in the exhaust air to non-detectable levels by adding bleed air through an air port connected to the exhaust duct;
- and
- passing the exhaust air from the ozone abatement chamber to a regenerative thermal oxidizer connected in series with the ozone abatement chamber such that the exhaust air exiting the ozone abatement chamber directly enters the regenerative thermal oxidizer.
A method comprising:
- causing exhaust air from an exhaust duct to enter a first ozone abatement chamber comprising a first central chamber and a first set of UV lamps, the first central chamber comprising a first series of laminar flow plates to ensure laminar flow through the first central chamber;
- causing the exhaust air from the first ozone abatement chamber to enter a second ozone abatement chamber comprising a second central chamber through which the exhaust air passes and a second set of UV lamps, the second central chamber comprising a second series of laminar flow plates to ensure laminar flow through the second central chamber;
- reducing a volume of sulfuric acid in the exhaust air to non-detectable levels by adding bleed air through an air port connected to the exhaust duct;
- and
- passing the exhaust air from the second ozone abatement chamber to a regenerative thermal oxidizer connected in series with the second ozone abatement chamber such that the exhaust air exiting the second ozone abatement chamber directly enters the regenerative thermal oxidizer.
A method comprising:
- causing exhaust air from an exhaust duct to enter an ozone abatement chamber, the ozone abatement chamber comprising a central chamber through which the exhaust air passes and one or more UV lamps, the central chamber comprising a first series of laminar flow plates to ensure laminar flow through the central chamber;
- reducing a volume of sulfuric acid in the exhaust air to non-detectable levels by adding bleed air through an air port connected to the exhaust duct;
- causing the exhaust air to pass through a second series of laminar flow plates positioned between an inlet and the ozone abatement chamber to further ensure laminar flow of the exhaust air as it enters the ozone abatement chamber;
- and
- passing the exhaust air from the ozone abatement chamber to a regenerative thermal oxidizer connected in series with the ozone abatement chamber such that the exhaust air exiting the ozone abatement chamber directly enters the regenerative thermal oxidizer.
Dependencies are inferred from the claim text.