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US 10,893,796 B2Granted
2D multi-layer thickness measurement
AssigneeTopcon Corporation
InventorsZhenguo Wang, Zaixing Mao, Kinpui Chan
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Abstract
A method for measuring layer thicknesses of a multi-layer structure includes generating first and second 2D images of the structure, each image being generated by measuring an intensity of a reflection of incident lights, from different discrete narrow spectral bands, on the structure. Thicknesses for at least one layer of the structure are then determined based on the measured reflection intensities at those locations.
Claims21
A method for measuring layer thicknesses of a multi-layer structure comprising:
- generating a first two-dimensional (2D) image of the structure by, for each pixel of the first 2D image, measuring an intensity of a reflection of a first incident light at a location of the structure corresponding to the pixel;
- generating a second 2D image of the structure by, for each pixel of the second 2D image, measuring an intensity of a reflection of a second incident light at a location of the structure corresponding to the pixel;
- determining a thickness for at least one layer of the structure at each location of the structure based on the intensities of the measured reflections of corresponding pixels in the first and second 2D images,
- wherein the first incident light is generated in a first discrete narrow spectral band, the second incident light is generated in a second discrete narrow spectral band, and the first and second discrete narrow spectral bands do not fully overlap, and
- wherein the intensities of the reflection of the first and second incident light are measured by a light sensor.
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Dependencies are inferred from the claim text.