Soldering a conductor to an aluminum metallization
AssigneeInfineon Technologies AG
InventorsEdmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba, Werner Reiss
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Abstract
A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.
Claims20
A method of soldering a conductor to an aluminum metallization, the method comprising:
- substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer;
- removing metal oxides from the substitute metal oxide layer or substitute metal alloy oxide layer by applying a flux material to the substitute metal oxide layer or to the substitute metal alloy oxide layer to generate a reduced substitute metal layer or substitute metal alloy layer;
- and
- soldering the conductor to the aluminum metallization via the reduced substitute metal layer or reduced substitute metal alloy layer using a solder material.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer;
- applying a flux material to the substitute metal oxide layer or to the substitute metal alloy oxide layer;
- and
- soldering the conductor to the aluminum metallization using a solder material, wherein the flux material is applied during soldering the conductor to the aluminum metallization.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer;
- applying a flux material to the substitute metal oxide layer or to the substitute metal alloy oxide layer to dissolve a substitute metal oxide in the substitute metal oxide layer or in the substitute metal alloy oxide layer to generate an oxide-reduced substitute metal or substitute metal alloy layer;
- and
- soldering the conductor to the aluminum metallization via the oxide-reduced substitute metal or substitute metal alloy layer using a solder material.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer;
- applying a flux material to the substitute metal oxide layer or to the substitute metal alloy oxide layer to dissolve a substitute metal oxide in the substitute metal oxide layer or in the substitute metal alloy oxide layer;
- and
- soldering the conductor to the aluminum metallization using a solder material, wherein the flux material is applied during soldering the conductor to the aluminum metallization.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- substituting an aluminum oxide layer on the aluminum metallization by a ZnO layer;
- applying a flux material to the ZnO layer to generate an oxide-reduced Zn layer region;
- and
- soldering the conductor to the aluminum metallization via the oxide-reduced Zn layer region using a PbSnAg solder material.
A method of soldering a conductor to an aluminum metallization, the method comprising:
- substituting an aluminum oxide layer on the aluminum metallization by a ZnO layer;
- applying a flux material to the ZnO layer;
- and
- soldering the conductor to the aluminum metallization using a PbSnAg solder material, wherein the flux material is applied during soldering the conductor to the aluminum metallization.
Dependencies are inferred from the claim text.