Multichip package with protocol-configurable data paths

A single package multi-die electronic device comprising:

• a first die disposed in the single package, wherein the first die comprises first input/output circuitry configured to operate in:
• a first mode in which a read clock signals or a write clock signals have a first frequency;
• and
• a second mode in which the read clock signals or the write clock signals have a second frequency that is double the first frequency;
• and
• a second die disposed in the single package, wherein the second die is communicatively coupled to the first die within the single package.

A system comprising:

• a first die of a first single package multi-die device comprising first input/output circuitry configured to operate in:
• a first mode in which a read clock frequency and a write clock frequency have a first frequency;
• and
• a second mode in which the read clock frequency and the write clock frequency are a second frequency that is double the first frequency;
• and
• a second die of a second single package multi-die device communicatively coupled to the first die, wherein the second die comprises second input/output circuitry configured to operate in the first mode and the second mode.