Film and method for producing a film

A film comprising a carrier substrate, an adhesion-promoting layer for applying the film to a target substrate and at least one electrically conductive layer, wherein the at least one electrically conductive layer forms an electrical functional structure in a functional region, wherein the at least one electrically conductive layer forms at least one contacting structure for contacting the electrical functional structure in at least one contacting region, and wherein the adhesion-promoting layer does not cover the at least one contacting region at least in areas when viewed perpendicularly to a plane spanned by the carrier substrate or wherein the adhesion-promoting layer is applied over the whole surface when viewed perpendicularly to a plane spanned by the carrier substrate,

• wherein the film comprises a detachment layer, wherein the detachment layer covers the at least one contacting region at least in areas when viewed perpendicularly to a plane spanned by the carrier substrate, and
• wherein the detachment layer covers a region adjoining the at least one contacting region.

A film comprising a carrier substrate, an adhesion-promoting layer for applying the film to a target substrate and at least one electrically conductive layer, wherein the at least one electrically conductive layer forms an electrical functional structure in a functional region, wherein the at least one electrically conductive layer forms at least one contacting structure for contacting the electrical functional structure in at least one contacting region, and wherein the adhesion-promoting layer does not cover the at least one contacting region at least in areas when viewed perpendicularly to a plane spanned by the carrier substrate or wherein the adhesion-promoting layer is applied over the whole surface when viewed perpendicularly to a plane spanned by the carrier substrate,

• wherein the at least one electrically conductive layer has a contact-strengthening layer.

A film comprising a carrier substrate, an adhesion-promoting layer for applying the film to a target substrate and at least one electrically conductive layer, wherein the at least one electrically conductive layer forms an electrical functional structure in a functional region, wherein the at least one electrically conductive layer forms at least one contacting structure for contacting the electrical functional structure in at least one contacting region, and wherein the adhesion-promoting layer does not cover the at least one contacting region at least in areas when viewed perpendicularly to a plane spanned by the carrier substrate or wherein the adhesion-promoting layer is applied over the whole surface when viewed perpendicularly to a plane spanned by the carrier substrate,

• wherein the film further comprises at least one intermediate adhesive layer, and
• wherein the at least one intermediate adhesive layer is arranged on the side of the carrier substrate facing away from the at least one electrically conductive layer.

A film comprising a carrier substrate, an adhesion-promoting layer for applying the film to a target substrate and at least one electrically conductive layer, wherein the at least one electrically conductive layer forms an electrical functional structure in a functional region, wherein the at least one electrically conductive layer forms at least one contacting structure for contacting the electrical functional structure in at least one contacting region, and wherein the adhesion-promoting layer does not cover the at least one contacting region at least in areas when viewed perpendicularly to a plane spanned by the carrier substrate or wherein the adhesion-promoting layer is applied over the whole surface when viewed perpendicularly to a plane spanned by the carrier substrate,

• wherein the film comprises a separating layer.

A film comprising a carrier substrate, an adhesion-promoting layer for applying the film to a target substrate and at least one electrically conductive layer, wherein the at least one electrically conductive layer forms an electrical functional structure in a functional region, wherein the at least one electrically conductive layer forms at least one contacting structure for contacting the electrical functional structure in at least one contacting region, and wherein the adhesion-promoting layer does not cover the at least one contacting region at least in areas when viewed perpendicularly to a plane spanned by the carrier substrate or wherein the adhesion-promoting layer is applied over the whole surface when viewed perpendicularly to a plane spanned by the carrier substrate,

• wherein the film can be reshaped.