Display module, display device and optically clear adhesive layer component

A display device, comprising a display module;

• wherein the display module comprises a display panel, an adhesive layer and a plate layer component, the adhesive layer is configured to adhere the display panel to the plate layer component, wherein:
• the display panel comprises a first substrate and a second substrate arranged opposite to each other, the first substrate comprises a first extension portion beyond an edge of the second substrate, and the second substrate is arranged proximate to the adhesive layer;
• the plate layer component comprises a second extension portion beyond the edge of the second substrate, and projections of the second extension portion and the first extension portion on a plane where the first substrate is located at least overlap partially;
• and
• the adhesive layer comprises a supporting portion extending to a position between the first extension portion and the second extension portion;
• wherein the display panel further comprises a drive chip and a first circuit board which are arranged at a side, proximate to the second extension portion, of the first extension portion;
• the drive chip is electrically connected with the first circuit board, the adhesive layer is provided with an avoidance area opposite to the drive chip and the first circuit board, and a projection of the avoidance area on the plane where the first substrate is located at least partially overlaps with projections of the drive chip and the first circuit board on the plane where the first substrate is located.

An optically clear adhesive layer component, comprising an adhesive layer body for adhering a display panel to a plate layer component, wherein:

• the display panel comprises a first substrate and a second substrate arranged opposite to each other, the first substrate comprises a first extension portion beyond an edge of the second substrate, a drive chip and a first circuit board are arranged at a side, proximate to the second substrate, of the first extension portion, the drive chip is electrically connected with the first circuit board, and the second substrate is arranged proximate to the adhesive layer body;
• the plate layer component comprises a second extension portion beyond the edge of the second substrate, and projections of the second extension portion and the first extension portion on a plane where the first substrate is located at least overlap partially;
• and
• the adhesive layer body comprises a supporting portion extending to a position between the first extension portion and the second extension portion, and is provided with an avoidance area opposite to the drive chip and the first circuit board, and a projection of the avoidance area on the plane where the first substrate is located at least partially overlaps with projections of the drive chip and the first circuit board on the plane where the first substrate is located.