Color film substrate and preparation method therefor, display device and glue applying system
AssigneesBoe Technology Group Co., Ltd., Hefei Xinsheng Optoelectronics Technology Co., Ltd.
InventorYanchun Lu
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Abstract
The present disclosure provides a color film substrate and a preparation method therefor, a display device and a glue applying system. The method for preparing a color film substrate includes forming a transparent insulating layer, wherein thickness of the transparent insulating layer is determined according to thickness of a metal film layer on an array substrate that is paired with the color film substrate.
Claims19
A method for preparing a color film substrate, comprising forming a transparent insulating layer, wherein a thickness of the transparent insulating layer is determined according to a thickness of a metal film layer on an array substrate that is paired with the color film substrate,
- wherein the transparent insulating layer is formed by applying glue on the color film substrate, and the step of forming the transparent insulating layer comprises:
- acquiring film forming data of the metal film layer on the array substrate paired with the color film substrate;
- determining the thickness of the metal film layer according to the film forming data;
- determining the thickness of the transparent insulating layer according to the thickness of the metal film layer;
- determining a pressure-time graph for applying glue on the color film substrate according to the thickness of the transparent insulating layer;
- and
- applying glue on a side, near the array substrate, of the color film substrate according to the pressure-time graph for applying glue to form the transparent insulating layer.
A display device, comprising:
- an array substrate;
- a color film substrate provided opposite to the array substrate;
- and
- a liquid crystal layer provided between the array substrate and the color film substrate,
- wherein a metal film layer is provided on a side of the array substrate near the color film substrate, a transparent insulating layer is provided on a side of the color film substrate near the array substrate, the transparent insulating layer is formed by applying glue on the color film substrate, and a thickness of the transparent insulation layer is determined according to a thickness of the metal film layer.
A glue applying system, comprising:
- a thickness measuring instrument configured to measure a thickness of a metal film layer;
- a transparent insulating layer thickness calculator configured to calculate a thickness of a transparent insulating layer according to the thickness of the metal film layer;
- and
- a glue applying machine configured to apply glue on a side, near the array substrate, of the color film substrate according to the thickness of the transparent insulation layer,
- wherein the transparent insulation layer is provided on a side of the color film substrate, the metal film layer is provided on a side of the array substrate that is paired with the color film substrate, and the transparent insulating layer is provided opposite to the metal film layer.
Dependencies are inferred from the claim text.