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US 10,884,274 B2Granted
Plastic substrate and device including the same
AssigneeKolon Industries, Inc.
InventorsHak Gee Jung, Jeong Han Kim, Hyo Jun Park
Life of this patent
Estimating the term…
Abstract
Disclosed is a plastic substrate, which includes a plastic film, a metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.
Claims38
A plastic substrate, comprising:
- a plastic film;
- a reflective metal layer formed on the plastic film, wherein the reflective metal layer has a thickness ranging from 1 to 1000 nm;
- a resin layer formed on the reflective metal layer, wherein the resin layer has a thickness ranging from 10 nm to 25.5 μm,
- wherein the plastic film and the resin layer are made of polyimides,
- wherein the polyimides have an average coefficient of linear thermal expansion of 50.0 ppm/° C. or less when measured in a temperature range from 50° C. to 250° C. using a thermomechanical analyzer for a film thickness of 50-100 μm, with a yellowness index of 15 or less,
- wherein the reflective metal layer has a multilayered structure,
- wherein the reflective metal layer comprises a lower metal layer and an upper metal layer,
- wherein the lower metal layer is made of at least one metal selected from the group consisting of aluminum, magnesium and alloys thereof;
- and
- wherein the upper metal layer is made of ITO (indium tin oxide) or IZO (indium zinc oxide), and
- wherein the plastic substrate has a light transmittance of 50% or more at a wavelength of 500 nm and a surface resistivity of 2.5×106Ω/sq or less.
8 more elements
A plastic substrate, comprising:
- a plastic film;
- a conductive metal layer formed on the plastic film, wherein the conductive metal layer has a thickness ranging from 1 to 1000 nm;
- a resin layer formed on the conductive metal layer, wherein the resin layer has a thickness ranging from 10 nm to 25.5 μm,
- a metal oxide layer formed on an upper surface or a lower surface of the resin layer, wherein the lower surface of the resin layer is a surface of a direction in which the plastic film is formed, and wherein the upper surface of the resin layer is an opposite surface of the lower surface of the resin layer
- wherein the plastic film and the resin layer are made of polyimides,
- wherein the polyimides have an average coefficient of linear thermal expansion of 50.0 ppm/° C. or less when measured in a temperature range from 50° C. to 250° C. using a thermomechanical analyzer for a film thickness of 50-100 μm, with a yellowness index of 15 or less,
- wherein the conductive metal layer is made of indium tin oxide or indium zinc oxide, and
- wherein the metal oxide layer comprises silver oxide (AgO).
5 more elements
Dependencies are inferred from the claim text.