Method for the collective production of a plurality of optoelectronic chips

A process for producing, on a wafer-scale, a plurality of optoelectronic chips, comprising the following steps:

• providing a receiver substrate comprising a plurality of elementary zones, each of which being configured to contain one optoelectronic chip, and each of which comprising at least one coupling waveguide integrated into the receiver substrate and configured to be optically coupled to a first optoelectronic component;
• transferring a plurality of pads to the plurality of elementary zones such that the pads partially cover the at least one coupling waveguide;
• and
• producing the first optoelectronic component from the pads such that each first optoelectronic component is facing the at least one coupling waveguide of a corresponding elementary zone,
• wherein, following the transferring step, each pad of the plurality of pads extends over a set of at least two adjacent elementary zones, so as to partially cover the at least one coupling waveguide of each of said adjacent elementary zones,
• wherein at least one first optoelectronic component of a first elementary zone and at least one second optoelectronic component of a second elementary zone adjacent to the first elementary zone and belonging to the set, are respectively spaced apart by an equal distance from a separation line forming a common border to the first and second adjacent elementary zones, and
• wherein the first and second optoelectronic components are produced from the same pad.