Leakage power characterization at high temperatures for an integrated circuit

A method comprising:

• preheating a hardware component;
• discontinuing preheating the hardware component;
• obtaining temperature and the leakage power measurements by continuously measuring temperature and leakage power of the hardware component after discontinuing the preheating;
• modeling, by a computing device, leakage power for the hardware component based on the temperature and leakage power measurements;
• and
• outputting, by the computing device, data relating to the temperature and leakage power measurements to an erasable programmable read only memory (EPROM).

A system configured to:

• apply a rail voltage to a hardware component;
• cause a cooling device, coupled to the hardware component, to operate at a cooling capacity;
• run a workload on the hardware component after applying the rail voltage and causing the cooling device to operate at a particular cooling capacity;
• discontinue the workload and discontinue clocks of the hardware component after a temperature of the hardware component has reached a first point;
• continuously measure temperature and leakage power of the hardware component after discontinuing the workload until the temperature of the hardware component has reached a second point;
• and
• adjust a power management procedure for the hardware component based on measured temperature and measured leakage power of the hardware component.