3D thermal detection circuits and methods
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSzu-Lin Liu, Jaw-Juinn Horng, Yung-Chow Peng
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSzu-Lin Liu, Jaw-Juinn Horng, Yung-Chow Peng
Estimating the term…
A three-dimensional integrated circuit includes a first layer including at least one sensing element configured to output at least one temperature-dependent voltage; and a second layer disposed vertically with respect to the first layer and coupled to the first layer by at least one via. The second layer includes: a compare circuit configured to generate at least one intermediate voltage in response to comparing the at least one temperature-dependent voltage to a feedback voltage; a control circuit configured to generate at least one control signal in response to the intermediate voltage; and a switching circuit configured to couple a capacitor coupled to a feedback node to one of a first voltage supply and a second voltage supply in response to the at least one control signal to generate an output signal that is based on a temperature sensed by the sensing element.
A three-dimensional integrated circuit, comprising:
A three-dimensional integrated circuit, comprising:
A method, comprising:
Dependencies are inferred from the claim text.