Shape memory material based thermal coupler/decoupler and method
AssigneeRaytheon Company
InventorsAdam C. Wood, Charles J. Bersbach
Life of this patent
Estimating the term…
Abstract
A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.
Claims20
A thermal interface comprising a shape memory material and a thermally-conductive material, wherein:
- the thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface, wherein the compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component, and wherein the expanded thermal interface is configured to substantially fill the thermal gap;
- the thermal interface is configured to be formed as the compressed thermal interface when the thermal interface remains below a transition temperature of the shape memory material;
- and
- the thermal interface forms a base ring with a plurality of curved petals, the curved petals configured to move towards the base ring and to move away from the base ring.
A system comprising:
- a first component;
- a second component;
- and
- a thermal interface comprising a shape memory material and a thermally-conductive material, wherein the thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface, wherein the compressed thermal interface is configured to partially fill a thermal gap between the first component and the second component, and wherein the expanded thermal interface is configured to substantially fill the thermal gap;
- wherein the thermal interface is configured to be formed as the compressed thermal interface when the thermal interface remains below a transition temperature of the shape memory material;
- and
- wherein the thermal interface forms a base ring with a plurality of curved petals, the curved petals configured to move towards the base ring and to move away from the base ring.
A method comprising:
- forming a thermal interface comprising a shape memory material and a thermally-conductive material, wherein the thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface, wherein the compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component, and wherein the expanded thermal interface is configured to substantially fill the thermal gap;
- and
- positioning the compressed thermal interface between the first component and the second component;
- wherein the thermal interface forms a base ring with a plurality of curved petals, the curved petals configured to move towards the base ring and to move away from the base ring.
Dependencies are inferred from the claim text.