Heat pipe and method to embed a heat pipe in a product

An electronic component assembly comprising:

• a component carrier selected from a printed circuit board (PCB), an intermediate PCB, and an IC-substrate;
• one or more heat pipes embedded in the component carrier, wherein at least one of the heat pipes comprises (i) a central section with a cavity filled with a heat transfer fluid, (ii) a first end section on a first end of the central section, and (iii) a second end section on the opposite second end of the central section, wherein the first and second end sections each comprises a landing structure integrally formed with, and thermoconductively coupled to, the central section, wherein the first end section, second end section, and central section are manufactured in one piece such that the first and second end sections are integrally formed with the central section, wherein each end section is made of flattened and pressed solid copper or solid copper alloy and has a greater width relative to the central section, wherein each of the one or more heat pipes is a single separate part configured to be embedded in the component carrier as an integral unit, and wherein each of the one or more heat pipes is already operational before being embedded within the component carrier;
• and
• at least one thermal via extending into the component carrier and thermoconductively coupled to one of the landing structures and to at least one heat dissipating component.

A heat pipe (10) for cooling an electronic device comprising:

• a central section (13) with a cavity (12) filled with a heat transfer fluid (20), wherein in a longitudinal direction (11) of the heat pipe (10) directly connected with the central section (13) are a first end section (14) on a first end of the central section (13) and a second end section (15) on an opposed second end of the central section (13),
• wherein the first end section (14) and the second end section (15) each comprise a landing structure (17) distal to the cavity and having a surface length (SL, SL1, SL2) and a surface width (SW, SW1, SW2),
• wherein each landing structure (17) is thermoconductively coupled with the central section (13) of the heat pipe (10),
• wherein each end section (14, 15) is made of flattened and pressed solid copper or solid copper alloy and has a greater width relative to the central section,
• wherein the first end section, second end section, and central section are manufactured in one piece such that the first and second end sections are structures integrally formed with the central section,
• wherein the heat pipe (10) is a single separate part configured to be embedded within a component carrier (100) as an integral unit, and
• wherein the heat pipe (10) is already operational before being embedded within the component carrier (100).