Loading patent…
AssigneeMassachusetts Institute of Technology
InventorsMitchell David Hsing, Parker Andrew Gould, Martin Arnold Schmidt
Estimating the term…
A substrate processing system that is optimized for the production of smaller volumes of semiconductor components is disclosed. To minimize cost, the substrate processing system is designed to accommodate smaller substrates, such as substrates having a diameter of roughly one inch. Additionally, the components of the substrate processing system are designed to be interchangeable, thereby further reducing cost and complexity. In certain embodiments, the substrate processing system comprises a lower assembly, which may be used with one or more upper assemblies. The lower assembly is used to support the substrate and provide many of the fluid, electrical, and sensor connections, while the upper assemblies include the apparatus required to perform a certain fabrication function. For example, different upper assemblies may exist for deposition, etching, sputtering and ion implantation.
A method of processing a substrate, the substrate having a characteristic dimension of up to about 1-2 inches, the method comprising:
A method of processing a substrate, the substrate having a characteristic dimension of up to about 1-2 inches, the method comprising:
Dependencies are inferred from the claim text.