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US 10,883,005 B1Granted
Catalyst ink for three-dimensional conductive constructs
AssigneeScience Applications International Corporation
InventorsDavid Morris, John Timler, Jason Schipp
Life of this patent
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Abstract
A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.
Claims11
An arbitrary three-dimensional construct prepared by
- i. preparing a catalyst ink comprising a colloidal solution comprising a solvent and palladium nanoparticles;
- and
- ii. depositing the catalyst ink from step (i) onto a surface of a substrate using aerosol jet printing;
- iii. subjecting the substrate to electro-less plating to plate the palladium nanoparticles with copper;
- and
- iv. repeating steps ii and iii until the three-dimensional construct is formed.
3 more elements
Dependencies are inferred from the claim text.