Laminate, and element comprising substrate manufactured using same

A method for producing a device substrate, comprising:

• obtaining a laminate comprising a carrier substrate, a first polyimide film comprising a first polyimide resin disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film opposite to the surface of the first polyimide film formed on a surface of the carrier substrate;
• wherein the carrier substrate, the first polyimide film, and the second polyimide film comprise peripheral cross-sectional surfaces;
• applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film to expose additional cross-sectional surfaces in the second polyimide film,
• wherein additional cross-sectional surfaces of the first polyimide film are not exposed and no physical stimulus is applied to the surface of the carrier substrate, and
• wherein the adhesive strength of the first polyimide film to the second polyimide film decreases when the physical stimulus is applied to the second polyimide film in the laminate to expose the additional cross-sectional surfaces of the second polyimide film;
• and
• separating the second polyimide film from the first polyimide film formed on the carrier substrate to obtain the device substrate.