Method of forming tin-containing material film and method of synthesizing a tin compound
AssigneesSamsung Electronics Co., Ltd., Dnf Co., Ltd.
InventorsSeung-min Ryu, Youn-soo Kim, Jae-soon Lim, Youn-joung Cho, Myong-woon Kim, Kang-yong Lee, Sang-ick Lee, Sang-yong Jeon
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Abstract
A tin compound, tin precursor compound for atomic layer deposition (ALD), a method of forming a tin-containing material film, and a method of synthesizing a tin compound, the tin compound being represented by Chemical Formula (I): wherein R1, R2, Q1, Q2, Q3, and Q4 are each independently a C1 to C4 linear or branched alkyl group.
Claims12
A method of forming a tin-containing material film, the method comprising:
- forming a monolayer of a tin precursor compound on a substrate in a reaction space, the tin precursor compound having a structure represented by Chemical Formula (I);
- forming a tin-containing material film by supplying a reactant onto the monolayer;
- and
- removing unreacted reactant from the vicinity of a surface of the tin-containing material film by purging the unreacted reactant,
- wherein R1, R2, Q1, Q2, Q3, and Q4 are each independently a C1 to C4 linear or branched alkyl group, and
- wherein:
- the reactant includes NH3, a monoalkylamine, a dialkylamine, a trialkylamine, an organic amine compound, a hydrazine compound, or mixtures thereof, and
- the tin material film is a tin nitride film.
A method of forming a tin-containing material film, the method comprising:
- providing a substrate in a reactor;
- supplying a tin precursor to the substrate to form a monolayer of the tin precursor, the tin precursor being represented by Chemical Formula (I);
- supplying a reactant onto the monolayer to form the tin-containing material film;
- and
- purging the reactor,
- wherein, in Chemical Formula (I), R1, R2, Q1, Q2, Q3, and Q4 are each independently a C1 to C4 linear or branched alkyl group, and
- wherein:
- the reactant includes NH3, a monoalkylamine, a dialkylamine, a trialkylamine, an organic amine compound, a hydrazine compound, or mixtures thereof, and
- the tin material film is a tin nitride film.
A method of forming a tin-containing material film, the method comprising sequentially performing a plurality of deposition cycles, each deposition cycle including:
- forming a monolayer of a tin precursor compound on a substrate in a reaction space, the tin precursor compound having a structure represented by Chemical Formula (I);
- forming a tin-containing material film by supplying a reactant onto the monolayer;
- and
- removing unreacted reactant from the vicinity of a surface of the tin-containing material film by purging the unreacted reactant,
- wherein R1, R2, Q1, Q2, Q3, and Q4 are each independently a C1 to C4 linear or branched alkyl group, and
- wherein:
- the reactant includes NH3, a monoalkylamine, a dialkylamine, a trialkylamine, an organic amine compound, a hydrazine compound, or mixtures thereof, and
- the tin material film is a tin nitride film.
Dependencies are inferred from the claim text.