Wafer level package for a mems sensor device and corresponding manufacturing process
AssigneeSTMicroelectronics (Malta) Ltd
InventorsConrad Cachia, David Oscar Vella, Damian Agius, Maria Spiteri
Life of this patent
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Abstract
A MEMS device package comprising a first die of semiconductor material including a contact pad and a second die of semiconductor material stacked on the first die. The second die is smaller than the first die. The second die includes a contact pad, and a conductive wire is coupled between the contact pad of the first die and a contact pad of the second die. A mold compound is on the second die and the first die. A vertical connection structure is on the contact pad of the second die. The vertical connection structure extends through the mold compound.
Claims20
A MEMS device package, comprising:
- a first die of semiconductor material including a contact pad;
- a second die of semiconductor material stacked on the first die, the second die being smaller than the first die, the second die having a contact pad;
- a conductive wire coupled between the contact pad of the first die and the contact pad of the second die;
- a mold compound on the second die and the first die;
- and
- a vertical connection structure on the contact pad of the second die, the vertical connection structure extending through the mold compound.
A semiconductor package, comprising:
- a first die of semiconductor material coupled to a second die of semiconductor material, the first die including a contact pad and a MEMS device coupled to the contact pad, the second die including a contact pad and one or more electronic circuit coupled to the contact pad;
- a conductive wire coupled to the contact pad of the first die and to the contact pad of the second die;
- a mold compound on the first die and the second die;
- and
- a vertical connection structure on the contact pad of the first die and extending through the mold compound.
A method of forming a semiconductor package, the method comprising:
- coupling a first die to a second die in a stacked manner;
- coupling a conductive wire to a contact pad of the first die and to a contact pad of the second die;
- forming a mold compound on the first and second dice;
- and
- forming a vertical connection structure on the contact pad of the first die.
Dependencies are inferred from the claim text.