Semiconductor structures provided within a cavity and related design structures
AssigneesInternational Business Machines Corporation, Wispry, Inc.
InventorsJeffrey C. Maling, Anthony K. Stamper, Dana R. DeReus, Arthur S. Morris, III
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Abstract
Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.
Claims19
A structure, comprising:
- at least one vent hole positioned over a free end of a beam structure, the at least one vent hole having a first size;
- and
- at least another vent hole positioned over a fixed end of the beam structure, the at least another vent hole having a second size, larger than the first size,
- wherein the at least one vent hole is sealed with a first material and the at least another vent hole is sealed with the first material and a second material, and
- the second material is deposited on the fixed end of the beam structure and the free end of the beam structure is devoid of the first material,
- wherein the beam structure is between an upper cavity and a lower cavity and the upper cavity is connected to the lower cavity by a connecting via, and
- the first material is selective on corners of the at least another vent hole to form a breadloafing pattern on the at least another vent hole.
Dependencies are inferred from the claim text.