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AssigneeAsm Technology Singapore Pte Ltd
InventorsShui Cheung Woo, Liang Hong Tang, Wan Yin Yau, Wai Yuen Cheung, Kui Kam Lam
Estimating the term…
A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.
A bonding apparatus comprising:
A method for aligning a position of a movable bond head collet with a position of a flip head collet configured to retrieve an electrical component and to transfer the electrical component to the bond head collet, the method comprising the steps of:
Dependencies are inferred from the claim text.