Barrier film substrate, method of making same, and use thereof

A method of using a barrier film substrate, the method comprising:

• installing the barrier film substrate within or around a building envelope, or at development or cleanup sites, to minimize transmission of chemical vapors including volatile organic compounds (“VOC”), methane, radon, and water, the barrier film substrate including:
• a first layer including a polymer and a transition metal having chemical sequestering properties such that, upon exposure of the barrier film substrate to one or more of the chemical vapors, a reaction occurs between the transition metal and the one or more chemical vapors whereby the one or more chemical vapors is broken down into chemical sub-components some of which can be filtered by the first layer, wherein the transition metal is copper;
• a second layer aligned with the first layer, the second layer including a polymer having impeding properties such that, upon the exposure of the barrier film substrate to the one or more of the chemical vapors, the second layer substantially blocks passage of the one or more of the chemical vapors through the barrier film substrate, thereby causing the one or more of the chemical vapors to further react with and be filtered by the first layer;
• and
• one or more additional layers aligned with at least one of the first layer or the second layer to provide structural support for the first layer and the second layer,
• wherein the barrier film substrate is oriented such that the first layer is closest to the chemical vapors.