Protective film for electronic device and window assembly using the same

An electronic device comprising:

• a housing;
• a display disposed inside the housing and including a flat part and a curved part;
• and
• a protective film, wherein the protective film comprises:
• a deformable outer layer formed with a synthetic resin;
• a deformable modified material layer attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to be deformed into a curved shape corresponding to a curved shape of the display prior to hardening and hardened into the curved shape responsive to receipt of an external stimuli;
• a deformable inner layer formed with a synthetic resin, attached with a lower surface of the deformable modified material layer;
• and
• an adhesive layer adhering to a lower surface of the deformable inner layer,
• wherein a bonding strength of the deformable modified material layer and the adhesive layer is increased due to placement of the deformable inner layer.

A windows assembly for an electronic device, the window assembly comprising:

• a deformable outer layer formed with a synthetic resin;
• a deformable modified material layer attached to a lower surface of the outer layer, to have fluidity, wherein the deformable modified layer is configured to be deformed into a curved shape corresponding to a curved shape of a display of the electronic device prior to hardening and hardened into the curved shape responsive to receipt of an external stimuli;
• a deformable inner layer formed with a synthetic resin, attached to a lower surface of the deformable modified material layer;
• an adhesive layer configured to be combined with a lower surface of the deformable inner layer;
• and
• a window layer configured to be combined with a lower surface of the adhesive layer and the electronic device,
• wherein the adhesive layer provides adhesive strength to a connection of the lower surface of the deformable inner layer and the window layer, and
• wherein a bonding strength of the deformable modified material layer and the adhesive layer is increased due to placement of the deformable inner layer.