Peeling method of flexible substrate

A peeling method of a flexible substrate, comprising the steps of:

• (a) forming a flexible substrate on a base substrate, wherein the flexible substrate and the base substrate are contacted directly and the flexible substrate has a plane area less than that of the base substrate, and forming a display element on the flexible substrate;
• (b) forming a blocking layer pattern on the base substrate formed with the flexible substrate, wherein the blocking layer pattern is located on the periphery of the flexible substrate, and adhering a protective film on the base substrate formed with the flexible substrate by an ultraviolet viscosity-reducing adhesive, wherein the plane area of the flexible substrate is less than that of the protective film, the protective film is further adhered to the base substrate by the ultraviolet viscosity-reducing adhesive, and the protective film does not contact the flexible substrate;
• (c) irradiating a region on the base substrate covered by the protective film through the base substrate with an ultraviolet light;
• and
• (d) peeling the protective film and the flexible substrate from the base substrate after the irradiation with an ultraviolet light is completed.