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US 10,882,157 B2Granted
Polishing pad and polishing method
AssigneeFujimi Incorporated
InventorsHitoshi Morinaga, Kazusei Tamai, Muneaki Tahara, Maiko Asai, Yuuichi Ito
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AssigneeFujimi Incorporated
InventorsHitoshi Morinaga, Kazusei Tamai, Muneaki Tahara, Maiko Asai, Yuuichi Ito
Estimating the term…
To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.
A polishing pad used for polishing an object to be polished containing metal, an alloy, or a metal oxide material and having at least one of a projection portion and a recessed portion on a surface, the polishing pad comprising:
Dependencies are inferred from the claim text.