Heatsink with retention mechanisms
AssigneeHewlett Packard Enterprise Development LP
InventorsAndrew Potter, Daniel W Tower, James Schulze, John Grady, Sunil Ganta, Chong Tan
Life of this patent
Estimating the term…
Loading patent…
AssigneeHewlett Packard Enterprise Development LP
InventorsAndrew Potter, Daniel W Tower, James Schulze, John Grady, Sunil Ganta, Chong Tan
Estimating the term…
Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.
A system, comprising:
A system, comprising:
Dependencies are inferred from the claim text.