Adsorption heat exchanger devices
AssigneeInternational Business Machines Corporation
InventorsThomas J. Brunschwiler, Javier V. Goicochea, Bruno Michel, Patrick Ruch
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Abstract
Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.
Claims4
A method for making an adsorbent structure for an adsorption heat exchanger device, comprising:
- applying a curable binder solution comprising a binder and solvent to a granular adsorbent material;
- evaporating the solvent;
- curing the binder;
- breaking the granular absorbent material into clusters of bonded granules;
- coating a structure of at least one cavity formed at an adsorption side of a heat exchanger structure with a pre-coat binder for bonding the clusters to said surface;
- and
- stacking the clusters in the at least one cavity;
- wherein the curable binder solution is diluted so that during said evaporating the binder becomes concentrated around contact points between the granules;
- wherein first localized bonds are formed around only the contact points between the granules upon said curing such that coating an entirety of a surface of the granules is prevented, and second localized bonds are formed around contact points between the heat exchanger structure and the granules upon said curing.
Dependencies are inferred from the claim text.