Substrate suction stage, substrate treatment apparatus, and substrate treatment method
AssigneeMitsubishi Electric Corporation
InventorTamio Matsumura
Life of this patent
Estimating the term…
Abstract
A substrate suction stage including a substrate support unit having a top surface, a cavity formed therein, an ejection hole formed therein and extending from the cavity to the top surface, and a suction hole formed therein for connecting the ejection hole and the top surface, and a gas supply unit for supplying gas into the cavity, wherein the ejection hole surrounds the suction hole in plan view, and when gas is supplied into the cavity, gas in the suction hole is discharged to the outside via the ejection hole.
Claims16
A substrate suction stage comprising:
- a substrate support unit having a top surface, a cavity formed on a side opposite to the top surface, an ejection hole formed in the top surface that extends from the cavity to the top surface, and a suction hole that connects a midway part of the ejection hole and the top surface and is formed in and extends through the top surface at a point closer to a center of the top surface than where the ejection hole is formed in the top surface;
- and
- a gas supply unit configured to supply gas into the cavity,
- wherein the top surface of the substrate support unit has a first top surface having the suction hole formed therein, and a second top surface that surrounds the first top surface and is formed to be lower than the first top surface, and the ejection hole extending to a step portion between the first top surface and the second top surface.
A substrate treatment apparatus comprising:
- a substrate suction stage including a substrate support unit having a top surface, a cavity formed on a side opposite to the top surface, an ejection hole formed in the top surface that extends from the cavity to the top surface, and a suction hole that connects a midway part of the ejection hole and the top surface and is formed in and extends through the top surface at a point closer to a center of the top surface than where the ejection hole is formed in the top surface, and a gas supply unit configured to supply gas into the cavity;
- and
- a liquid treatment apparatus for performing a liquid treatment on a substrate on the substrate suction stage,
- wherein the top surface of the substrate support unit has a first top surface having the suction hole formed therein, and a second top surface that surrounds the first top surface and is formed to be lower than the first top surface, and the ejection hole extending to a step portion between the first top surface and the second top surface.
A substrate treatment method comprising:
- placing a substrate on a top surface of a substrate support unit;
- and
- performing a liquid treatment on the substrate while, by supplying gas from one gas supply unit into a cavity inside the substrate support unit, the gas is sprayed from an ejection hole intercommunicating with the cavity to a peripheral portion of a back surface of the substrate, and gas is discharged from a suction hole for connecting the top surface of the substrate support unit and the ejection hole, thereby causing the substrate to be sucked on the substrate support unit.
Dependencies are inferred from the claim text.