Back to results
US 10,882,138 B2Granted
Laser cutting apparatus and laser cutting method
AssigneeMitsubishi Heavy Industries, Ltd.
InventorYoshinao Komatsu
Life of this patent
Estimating the term…
Abstract
A laser cutting apparatus includes a laser beam irradiation apparatus configured to radiate a laser beam, a pressure wave irradiation part including a plurality of pressure wave sources configured to radiate pressure waves toward a fusing part or a section to be cut by the laser beam, and a jet injection part configured to inject jets toward the fusing part or the section to be cut along respective outer circumferential sides of the pressure waves.
Claims5
A laser cutting apparatus comprising:
- a laser beam irradiation apparatus configured to radiate a laser beam;
- a pressure wave irradiation part including a plurality of pressure wave sources configured to radiate pressure waves toward a fusing part or a section to be cut by the laser beam;
- and
- a jet injection part configured to inject jets along respective outer circumferential sides of the pressure waves toward the fusing part or the section to be cut.
1 more element
A laser cutting method comprising:
- a process of injecting a jet along an outer circumferential side of a pressure wave toward a fusing part or a section to be cut while removing dross by radiating the pressure wave to the fusing part or the section to be cut, wherein the fusing part or the section to be cut generated by irradiating an object to be processed with a laser beam.
Dependencies are inferred from the claim text.