Electrical contacting device for an implantable medical device, and method for production

An electrical contacting device for a medical implantable device, comprising:

• an electrically insulating base body with a first and a second surface;
• wherein the base body includes a ceramics;
• an electrically conductive conducting element that extends, at least in part, from the first surface of the base body through the base body;
• wherein the conducting element includes a cermet and is connected to the ceramics of the base body in firmly bonded manner through a sintered connection;
• a contact element including a metal, wherein the contact element is connected to the conducting element in electrically conductive manner and can be connected to an electrically conductive structure;
• wherein the contacting device comprises an adhesion element, wherein the adhesion element is connected to the contact element in firmly bonded manner;
• wherein the adhesion element includes an adhesion promoter in order to form a firmly bonded connection at least to the first surface of the base body;
• and
• wherein the adhesion element comprises a first layer, wherein the first layer includes a metal and extends through a second layer to the conducting element, wherein the second layer includes a dielectric material and is connected in firmly bonded manner to at least the first layer and the first surface of the base body.

A method for the production of an electrical contacting device for a medical implantable device, wherein the method comprises:

• a. providing an electrically insulating base body having a first and a second surface, wherein the base body comprises a ceramics, and wherein the base body includes an electrically conductive conducting element that extends, at least in part, from the first surface of the base body through the base body, wherein the conducting element includes a cermet and is connected in firmly bonded manner to the ceramics of the base body through a sintered connection;
• b. generating an adhesion element comprising an adhesion promoter on the base body through a sintering step 1 from an adhesion element precursor while forming a firmly bonded connection between the adhesion element and the first surface of the base body and between the adhesion element and the conducting element;
• and
• c. generating a contact element including a metal on the adhesion element through a sintering step 2 from a contact element precursor to form a firmly bonded connection between the contact element and the adhesion element and form an electrical connection between the contact element and the conducting element via the adhesion element.