Slide member and method for manufacturing same
AssigneeDaido Metal Company Ltd.
InventorKazuaki Toda
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Abstract
The purpose of the present invention is to provide: a slide member in which the bonding strength between a Bi-containing copper alloy layer and a substrate is enhanced; and a method for manufacturing the slide member. The slide member according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The volume ratio of Bi phases in the region of the copper alloy layer extending 10 μm from the bonding interface with the substrate is not more than 2.0%. The slide member is manufactured by casting a molten copper alloy onto the substrate and causing the copper alloy to unidirectionally solidify.
Claims10
A sliding member comprising:
- a substrate;
- and
- a copper alloy layer bonded to the substrate,
- wherein the copper alloy layer comprises a copper alloy including 4.0 to 25.0 mass % of Bi, the copper alloy having a structure in which Bi phases are dispersed in a copper alloy matrix, and
- wherein a volume ratio of the Bi phases in a region extending 10 μm from a bonding interface between the copper alloy layer and the substrate is not more than 3.0%.
Dependencies are inferred from the claim text.