# US 10,874,034 B1 · Pump driven liquid cooling module with tower fins > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,874,034 B1 - Document ID: US10874034B1 - Status: Granted - Kind: B1 - Application number: 16/674,860 - Filed: 2019-11-05 - Granted: 2020-12-22 - Earliest claimed: 2019-11-05 - Assignees: Facebook, Inc. - Applicants: Facebook, Inc. - Inventors: Cheng Chen; Saket Suhas Karajgikar - Web page: https://patentgrep.com/patent/US10874034B1 ## CPC - H05K 7/20772: {within server blades for removing heat from heat source} - H10W 40/73: for cooling by change of state - H05K 7/20254: {Cold plates transferring heat from heat source to coolant} - H05K 7/20263: {Heat dissipaters releasing heat from coolant} - H05K 7/20272: {Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds} - H10W 40/47: by flowing liquids, e.g. forced water cooling - H10W 40/43: by flowing gases, e.g. forced air cooling - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A pump driven liquid cooling device with tower fins is disclosed. The device includes a thermal interface component configured to be coupled to an electronic component to be cooled via the thermal interface component. The device further includes at least one coolant pipe coupled to the thermal interface component. The device includes a local heat exchanger coupled to the at least one coolant pipe and comprising a plurality of stacked horizontal fins. The device includes a local coolant pump configured to pump a liquid coolant through the at least one coolant pipe in a local closed loop. ## Claims ### Claim 1 A device, comprising: a thermal interface component configured to be coupled to an electronic component to be cooled via the thermal interface component; at least one coolant pipe coupled to the thermal interface component, wherein the at least one coolant pipe comprises a plurality of portions of the at least one coolant pipe that form a local closed loop; a local heat exchanger coupled to the at least one coolant pipe and comprising a plurality of stacked horizontal fins; and a local coolant pump configured to pump a liquid coolant through the at least one coolant pipe in the local closed loop, wherein the plurality of portions of the at least one coolant pipe comprises one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component, and wherein the plurality of stacked horizontal fins is coupled to the one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component. ### Claim 2 (depends on 1) The device of claim 1, wherein the electronic component is mounted on a printed circuit board in a server chassis. ### Claim 3 (depends on 1) The device of claim 1, wherein the thermal interface component comprises a lower flat interface surface in contact with the electronic component and absorbing heat from the electronic component. ### Claim 4 (depends on 1) The device of claim 1, wherein the thermal interface component comprises a cold plate formed with a metal. ### Claim 5 (depends on 1) The device of claim 1, wherein the thermal interface component comprises a cold plate comprising one or more inlets and one or more outlets directing the liquid coolant to flow in and out of one or more internal channels that direct the liquid coolant to flow through the thermal interface component. ### Claim 6 (depends on 5) The device of claim 5, wherein the one or more internal channels comprise a plurality of micro-channels that winds through the thermal interface component. ### Claim 7 (depends on 1) The device of claim 1, wherein the one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component comprise one or more vertical portions running substantially perpendicular to the electronic component. ### Claim 8 (depends on 1) The device of claim 1, wherein the plurality of portions of the at least one coolant pipe comprises one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component. ### Claim 9 (depends on 8) The device of claim 8, wherein the plurality of stacked horizontal fins are coupled to the one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component. ### Claim 10 (depends on 8) The device of claim 8, wherein the one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component comprise one or more vertical portions running substantially perpendicular to the electronic component. ### Claim 11 (depends on 9) The device of claim 9, wherein the plurality of portions of the at least one coolant pipe comprises one or more portions directing the liquid coolant substantially horizontally and connecting the one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component with the one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component to form the local closed loop. ### Claim 12 (depends on 1) The device of claim 1, further comprising a reservoir coupled to the local coolant pump. ### Claim 13 (depends on 1) The device of claim 1, wherein the device is pre-assembled as a single module and collocated with the electronic component. ### Claim 14 (depends on 1) The device of claim 1, wherein the device has a cooling limit above 500 watts. ### Claim 15 (depends on 1) The device of claim 1, wherein the device has a height limit above 90 millimeters. ### Claim 16 A method, comprising: providing a thermal interface component configured to be coupled to an electronic component to be cooled via the thermal interface component; providing at least one coolant pipe coupled to the thermal interface component, wherein the at least one coolant pipe comprises a plurality of portions of the at least one coolant pipe that form a local closed loop; providing a local heat exchanger coupled to the at least one coolant pipe and comprising a plurality of stacked horizontal fins; and providing a local coolant pump configured to pump a liquid coolant through the at least one coolant pipe in the local closed loop, wherein the plurality of portions of the at least one coolant pipe comprises one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component, and wherein the plurality of stacked horizontal fins is coupled to the one or more portions directing the liquid coolant upwards and away from the thermal interface component and the electronic component. ### Claim 17 (depends on 16) The method of claim 16, wherein the plurality of portions of the at least one coolant pipe comprises one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component. ### Claim 18 (depends on 17) The method of claim 17, wherein the plurality of stacked horizontal fins are coupled to the one or more portions directing the liquid coolant downwards and back to the thermal interface component and the electronic component.