# US 10,874,024 B2 · Modules and systems for damping excitations within fluid-filled structures

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- Number: US 10,874,024 B2
- Document ID: US10874024B2
- Status: Granted
- Kind: B2
- Application number: 16/000,771
- Filed: 2018-06-05
- Published: 2018-10-04
- Granted: 2020-12-22
- Earliest claimed: 2016-12-07
- Assignees: Raytheon Company
- Applicants: Raytheon Company
- Inventors: Florian P. Lukowski, Jr.; Paul M. Shaheen; Charles Chu
- Web page: https://patentgrep.com/patent/US10874024B2

## CPC

- H05K 5/0256: {of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms}
- F16F 7/1017: {by fluid means}
- F16F 7/104: the inertia member being resiliently mounted {(F16F7/1022 takes precedence)}
- F16F 9/103: {Devices with one or more members moving linearly to and fro in chambers, any throttling effect being immaterial, i.e. damping by viscous shear effect only (F16F9/53 takes precedence)}
- F16F 9/3207: {Constructional features (F16F9/34 - F16F9/50 take precedence; assembly or repair F16F9/3271)}
- F16F 15/023: using fluid means
- H05K 7/20154: {Heat dissipaters coupled to components}
- H05K 7/20218: {using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)}
- H05K 7/20263: {Heat dissipaters releasing heat from coolant}
- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- F16F 2222/08: Inertia
- F16F 2222/12: Fluid damping
- F16F 2230/06: Fluid filling or discharging
- F16F 2234/08: spherical
- F16F 2238/04: Damper
- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- F16F: SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A system or structure subject to external mechanical dynamic loading excitations propagated within the system or structure comprising a fluid filled structure and a fluid volume operable to facilitate fluid flow about at least part of the structure. Excitations within the structure can be propagated throughout. The system can further comprise a tuned mass damper (TMD) located within the fluid volume. The TMD can leverage the viscous properties of the fluid to attenuate the excitations within the structure. The TMD can comprise a mass and a spring operably connected to the mass. The TMD can further comprise a fluid resistance facilitating fluid flow about the mass and the spring for damping and a secondary tuning device operably connected to at least one of the mass and the spring and the supporting fluid-filled structure.

## Claims

### Claim 1

A system subject to excitations propagated within the system, comprising:
a fluid filled structure comprising an aperture;
a fluid volume defined at least in part by the fluid filled structure, the fluid volume operable to facilitate fluid flow about at least part of the structure, wherein excitations within the structure are propagated in the fluid volume;
a tuned mass damper (TMD) located within the fluid volume, the TMD leveraging viscous properties of the fluid to attenuate the excitations within the structure; and
a secondary tuning device operably coupled to the TMD and to the fluid filled structure, wherein the secondary tuning device is selectively adjustable from outside of the fluid filled structure via the aperture in the fluid filled structure to tune the dynamic properties of the TMD by tuning a stiffness of the TMD after assembly of the system.

### Claim 2 (depends on 1)

The system according to claim 1, further comprising a second TMD located within the fluid volume.

### Claim 3 (depends on 2)

The system according to claim 2, wherein the second TMD is positioned at or proximate an antinode location of the structure.

### Claim 4 (depends on 1)

The system according to claim 1, further comprising a plurality of TMDs, each TMD being located at or proximate a different antinode location of the structure.

### Claim 5 (depends on 1)

The system according to claim 1, wherein the TMD comprises:
a mass;
a spring operably connected to the mass; and
a fluid resistance feature facilitating fluid flow about the mass and the spring for damping.

### Claim 6 (depends on 5)

The system according to claim 5, wherein the secondary tuning device is operably connected to at least one of the mass and the spring.

### Claim 7 (depends on 5)

The system of claim 5, wherein the fluid resistance feature comprises an orifice, the orifice defined by at least one of the mass and the spring.

### Claim 8 (depends on 7)

The system of claim 7, wherein the orifice is formed through at least one of the mass and the spring.

### Claim 9 (depends on 5)

The system of claim 5, wherein the fluid resistance feature comprises a plurality of orifices, the plurality of orifices formed through at least one of the mass and the spring.

### Claim 10 (depends on 1)

The system of claim 1, wherein the fluid filled structure comprises an electronics module in the form of a heatsink.

### Claim 11 (depends on 1)

The system of claim 1, further comprising a plurality of TMDs mounted within the fluid volume proximate one or more antinodes.

### Claim 12 (depends on 10)

The system of claim 10, wherein the TMD is located within a secondary fluid flow path, the secondary fluid flow path being in fluid communication with a primary fluid flow path.

### Claim 13

A tuned mass damper (TMD), comprising:
a spring coupled to a structure;
a mass operably couple to the spring, wherein the spring facilitates movement of the mass relative to the structure in response to a fluid impinging on the TMD;
a fluid resistance feature comprising at least one orifice formed through the mass, the at least one orifice facilitating fluid flow from a structure through at least one of the mass or the spring in two directions for damping excitations; and
wherein the TMD is mountable within a fluid reservoir of the structure in the form of an electronics module, the TMD operable to leverage viscous properties of fluid within the fluid reservoir to attenuate excitations within the electronics module as propagated through the electronics module.

### Claim 14 (depends on 13)

The TMD according to claim 13, further comprising at least one orifice formed through the spring.

### Claim 15 (depends on 13)

The TMD according to claim 13, wherein the at least one orifice comprises a plurality of orifices.

### Claim 16 (depends on 15)

The TMD according to claim 15, wherein the at least one orifice comprises a plurality of orifices formed through the mass.

### Claim 17 (depends on 13)

The TMD according to claim 13, further comprising a secondary tuning device operably connected to at least one of the mass and the spring.

### Claim 18 (depends on 17)

The TMD according to claim 17, wherein the secondary tuning device is adjustable to tune the TMD's dynamic behavior.

### Claim 19 (depends on 13)

The TMD according to claim 13, wherein, during use, the at least one orifice is configured to facilitate continuous fluid flow through the TMD within the fluid reservoir of the heatsink.